Dr. Andy Yendi Tsen

Dr. Andy Yendi TsenDr. Andy Yendi TsenDr. Andy Yendi Tsen

ydtsen@ieee.org

https://scholar.google.com

https://orcid.org/0009-0007-5419-206X

About Dr. Tsen

Career

  • Industry Mentor, Dep. of Industry Management, National Taiwan University of Science and Technology (NTUST), Taiwan, from 2025
  • Senior Project Consultant, Taiwan-Singapore IP Science and Technology Innovation Center, National Taiwan University of Science and Technology (NTUST), Taiwan, 2024-2025
  • Manager of Intelligent Manufacturing Center, Taiwan Semiconductor Manufacturing Co. (tsmc), 2007~2022 (retired)
  • Vice Director of Intelligent Manufacturing Dep., CTCI Advanced System Inc., Taiwan, 1998-2007
  • Postdoc of ChE Dep. of National Tsing Hua University (NTHU), Taiwan, 1997-1998
  • Ph.D of ChE Dep. of National Tsing Hua University (NTHU), Taiwan, since 1995
  • Visiting scholar of ChE Dep. of Washington University in St Louis (WUST), US, 1993

Publications

  • Deep Hierarchical Reinforcement Learning CMP Run to Run Control. International Conference on Flexible Automation and Intelligent Manufacturing. Springer, Cham, 2024
  • Reinforcement Learning Chemical-mechanical Polishing Run-to-Run Controller, 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE), 2023
  • INTRA-FIELD PROCESS CONTROL FOR LITHOGRAPHY, TW Patent I711888, 2020
  • METHOD AND/OR SYSTEM FOR CHEMICAL MECHANICAL PLANARIZATION (CMP), TW Patent I633969, 2018
  • CALIBRATION APPARATUS AND ADJUSTMENT METHOD FOR ADJUSTING ILLUMINATION DEVICE OF LITHOGRAPHY APPARATUS, TW Patent I582547, 2017
  • EXPOSING CORRECTION METHOD AND CONTROL APPARATUS, TW Patent I521313, 2016
  • METHODS OF AUTOMATIC BOUNDARY CONTROL FOR SEMICONDUCTOR PROCESSES, TW Patent I496019, 2015
  • ADVANCED PROCESS CONTROL METHOD AND SYSTEM, TW Patent I410822, 2013
  • A novel multiple resolution APC on CMP and Litho-Etching, 2013 e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
  • METHOD FOR BIN-BASED CONTROL, TW Patent I402762, 2013
  • METHOD AND APPARATUS FOR ADVANCED PROCESS CONTROL, TW Patent I399625, 2013
  • Method and system for implementing virtual metrology in semiconductor fabrication, US Patent US-8396583-B2, 2013
  • System and method for implementing multi-resolution advanced process control, US Patent US-8394719-B2, 2013
  • System and method for implementing a virtual metrology advanced process control platform, US Patent US-8437870-B2, 2013
  • Advanced process control with novel sampling policy, US Patent US-8392009-B2, 2013
  • SYSTEM AND METHOD FOR IMPLEMENTING MULTI-RESOLUTION ADVANCED PROCESS CONTROL, TW Patent I392987, 2013
  • Advanced process control for new tapeout product, US Patent, US-8239056-B2, 2012
  • Method and system for tuning advanced process control parameters, US Patent US-8229588-B2
  • Method and apparatus for advanced process control, US Patent US-8224475-B2, 2012
  • System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) with routing model, US Patent US-821934, 2012
  • System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture, US Patent US-8108060-B2, 2012
  • Method for a bin ratio forecast at new tape out stage, US Patent US-8082055-B2, 2011
  • Method for bin-based control, US Patent US-8041451-B2, 2011
  • A Rosebrock’s diagonal dominance study on multiple resolution APC, 2011 e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM), 2011
  • System and method for implementing multi-resolution advanced process control, US Patent US-7951615-B2, 2011
  • Method using artificial intelligence neural network to proceed on-line real-time optimization for furnace and system, TW Patent I230868, 2005
  • Predictive control of quality in batch polymerization using hybrid ANN models, AIChE journal, 1996


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